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Wafer-Level Integrated Systems: Implementation Issues by Stuart K. Tewksbury

By Stuart K. Tewksbury

From the point of view of advanced platforms, traditional Ie's might be considered as "discrete" units interconnected in accordance with method layout pursuits imposed on the circuit board point and better degrees within the approach implementation hierarchy. besides the fact that, silicon monolithic circuits have improved to such complicated capabilities transition from a philosophy of built-in circuits (Ie's) to 1 of built-in sys­ tems is important. Wafer-scale integration has performed an immense function over the last few years in highlighting the approach point matters so that it will most importantly impression the implementation of advanced monolithic platforms and approach parts. instead of being a progressive method, wafer-scale integration will evolve clearly from VLSI as illness avoidance, fault tolerance and checking out are brought into VLSI circuits. winning creation of illness avoidance, for instance, relaxes limits imposed via yield and value on Ie dimensions, permitting the monolithic circuit's sector to be selected in response to the average partitioning of a method into person capabilities instead of enforcing zone limits as a result of illness densities. The time period "wafer­ point" may be extra applicable than "wafer-scale". A "wafer-level" monolithic approach part can have dimensions starting from traditional yield-limited Ie dimensions to complete wafer dimensions. during this feel, "wafer-scale" only represents the most obvious top functional restrict imposed by way of wafer sizes at the sector of monolithic circuits. The transition to monolithic, wafer-level built-in structures would require a mapping of the whole diversity of process layout concerns onto the layout of monolithic circuit.

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52, pp. 1713-1770 (1964). [2] R. C. Aubusson and I. Catt, Wafer-scale integration - a fault-tolerant procedure, IEEE J. Solid-State Circuits, vol. SC-13, pp. 339-344 (1978). [3] A. J. Rushton and C. R. Jesshope, The reconfigurable processor array - an architecture in need of WSI, in Wafer Scale Integration, C. Jesshope and W. Moore (Eds), Adam Hilger, Bristol, England, pp. 148-158 (1986). [4] C. Jesshope and W. Moore (Eds), Wafer Scale Integration, Adam Hilger, Bristol, England (1986). [5] G. Saucier and J.

Donlan, G. F. Taylor, R. H. Steinvorth, A. S. Bergendahl and J. F. McDonald, Wafer scale integration using discretionary microtransmission line interconnections, in Wafer Scale Integration, C. R. Jesshope and W. Moore (Eds), Adam Hilger, Bristol, England, pp. 31-45 (1986). [29] G. Chevalier and G. Saucier, A programmable switch matrix for the wafer scale integration of a processor array, in Wafer Scale Integration, C. R. Jesshope and W. Moore (Eds), Adam Hilger, Bristol, England, pp. 92-100 (1986).

H. Woods, MOS VLSI reliability and yield trends, Proc. IEEE, vol. 74, pp. 1715-1729 (1986). [38] M. P. Fourman, Redundancy strategies for WSI, in Wafer Scale Integration, C. R. Jesshope and W. Moore (Eds), Adam Hilger, Bristol, England, pp. 72-81 (1986). [39] C. H. Stapper, F. M. Armstrong and K. Saji, Integrated circuit yield statistics, Proc. IEEE, vol. 71, pp. 453-470 (1983). 22 REFERENCES [40] J. N. Coleman and R. M. Lea, Clock distribution techniques for wafer scale integration, in Wafer Scale Integration, C.

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