By Ban Wong, Franz Zach, Victor Moroz, Anurag Mittal, Greg Starr, Andrew Kahng(auth.)
Notice cutting edge instruments that pave the way in which from circuit and actual layout to fabrication processing
Nano-CMOS layout for Manufacturability examines the demanding situations that layout engineers face within the nano-scaled period, equivalent to exacerbated results and the confirmed layout for manufacturability (DFM) technique in the middle of expanding variability and layout approach interactions. as well as discussing the problems because of the continuing dimensional scaling in conformance with Moore's legislation, the authors additionally take on complicated matters within the layout approach to beat the problems, together with using a sensible first silicon to aid a predictable product ramp. in addition, they introduce a number of rising recommendations, together with pressure proximity results, contour-based extraction, and layout technique interactions.
This publication is the sequel to Nano-CMOS Circuit and actual layout, taking layout to know-how nodes past 65nm geometries. it truly is divided into 3 elements:
-
half One, Newly Exacerbated results, introduces the newly exacerbated results that require designers' awareness, starting with a dialogue of the lithography elements of DFM, by means of the influence of format on transistor functionality
-
half , layout recommendations, examines find out how to mitigate the influence of approach results, discussing the method had to make sub-wavelength patterning expertise paintings in production, in addition to layout recommendations to accommodate sign, energy integrity, good, tension proximity results, and method variability
-
half 3, the line to DFM, describes new instruments had to help DFM efforts, together with an auto-correction instrument in a position to solving the format of cells with a number of optimization objectives, through a glance forward into the way forward for DFM
through the ebook, real-world examples simplify advanced suggestions, supporting readers see how they could effectively deal with tasks on Nano-CMOS nodes. It presents a bridge that enables engineers to head from actual and circuit layout to fabrication processing and, briefly, make designs that aren't merely practical, yet that still meet strength and function ambitions in the layout schedule.Content:
Chapter 1 creation (pages 1–17):
Chapter 2 Lithography?Related elements of DFM (pages 19–125):
Chapter three interplay of format with Transistor functionality and rigidity Engineering innovations (pages 126–183):
Chapter four sign and gear Integrity (pages 185–255):
Chapter five Analog and Mixed?Signal Circuit layout for Yield and Manufacturability (pages 256–280):
Chapter 6 layout for Variability, functionality, and Yield (pages 281–332):
Chapter 7 Nano?CMOS layout instruments: past Model?Based research and Correction (pages 333–380):
Read Online or Download Nano-CMOS Design for Manufacturabililty: Robust Circuit and Physical Design for Sub-65 nm Technology Nodes PDF
Similar design books
Decorating with Flowers: A Stunning Ideas Book for all Occasions
Use clean plants to make a dramatic distinction at your residence. .. and dazzle with the facility of plant life for those who entertain! adorning with flora celebrates the newest developments in modern floral layout with a tropical twist. that includes encouraged desk settings and installations, this outstanding booklet will motivate you to create your personal unforgettable floral creations!
Robust Electronic Design Reference Book
If you happen to layout electronics for a residing, you would like strong digital layout Reference e-book. Written through a operating engineer, who has positioned over a hundred and fifteen digital items into creation at Sycor, IBM, and Lexmark, powerful digital layout Reference covers the entire quite a few elements of designing and constructing digital units and structures that: -Work.
The method of hot temperature section transition of infrequent earth permanent-magnet alloys is printed via pictures taken via excessive voltage TEM. the connection among the formation of nanocrystal and magnetic houses is mentioned intimately, which results alloys composition and instruction approach. The scan effects proven a few presumptions, and have been invaluable for next clinical examine and developing new permanent-magnet alloys.
- System 80+ Standard [nucl. powerplnt] Design - Piping Benchmark Probs
- Design and Manufacture of Plastic Components for Multifunctionality: Structural Composites, Injection Molding, and 3D Printing (Plastics Design Library)
- The Architect as Worker: Immaterial Labor, the Creative Class, and the Politics of Design
- Analysis of Kinetic Data, 1st Edition
Extra info for Nano-CMOS Design for Manufacturabililty: Robust Circuit and Physical Design for Sub-65 nm Technology Nodes
Sample text
By means of a robot, wafers are first transferred from the track to a station for coarse wafer alignment. , the focus) map and the map of the wafer position are generated. They are then passed onto the wafer exposure stage until they are finally returned to the track for further resist processing. Finally, the entire system is enclosed for environmental control. Within this enclosure, humidity and temperature are maintained so as to prevent changes in lens characteristics that affect the image.
In addition to increased costs for the design and an increased probability of initial design failures, the implications of design failures have also become more severe. As product cycles have dropped from about two years to 12 months, delays in product delivery and the resulting loss in revenue constitute a serious issue. In this chapter we provide a brief overview of the economic factors that affect manufacturing and design at the advanced nodes. On the one hand, we see rising manufacturing costs as exemplified by the rising capital investment LITHOGRAPHIC TOOLS AND TECHNIQUES FOR ADVANCED TECHNOLOGY NODES 27 necessary for wafer fabrication lines, skyrocketing process development costs, and increasing mask costs.
Either memories (DRAM and flash) or logic products such as microprocessors, graphics chips, and FPGAs]. We therefore omit some techniques, such as optical maskless lithography [3], e-beam [4,5], imprint lithography [6], and extreme ultraviolet [7]. A recent comparison of various techniques is available in a paper by Liu [8]. 2 Lithographic Infrastructure The process used for manufacturing integrated circuits includes a sequence of microlithographic steps in which patterns are formed by projection printing.