By F. Aziz
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Example text
Reduction of Particulate Contamination in Wafer Processing, pp. 220-225. Santa Clara, California: Applied Materials INC. , 2000. Silicon Wafer Processing, Applied Material Summer, US. pdf. Accessed on 24 March 2010. K. 1987. Particle Technology Laboratory. Mechanical Engineering Department, University of Minnesota, Minneapolis, England. Bordon, P. 1990. The Nature of Particle Generation in Vacuum Process Machines. IEEE Transactions on Semiconductor Manufacturing 3:189-194. , Belinski, S. and Hackwood, S.
Wang (2008) developed a decision-making procedure that could be used for supplier selection when product part modifications were necessary. The aim of the research was to determine acceptable near-optimal solutions within a short period of time using a solution-finding model based on Genetic Algorithms (GA). Aksoy & Öztürk (2011) presented a neural network-based supplier selection and supplier performance evaluation system for use in a just-in-time (JIT) production environment. Chang et al. (2011) proposed the use of a fuzzy decision-making method to identify evaluation factors that could be used for supplier selection.
Analysis of true causes From the verification process of potential true causes, wafer transfer in load lock and sputter target life has the most significant relationship to shutdown event. Since the most significant root cause is the sputter target life, this project will only focus on the improvement of sputter target life. 1 Sputter target life improvement From the data of shutdown event versus sputter target life, observation can be made that the rate of machine shutdown is increasing by the increment of sputter target life.