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Electrical Modeling and Design for 3D System Integration: 3D by Er?Ping Li(auth.), Lajos Hanzo(eds.)

By Er?Ping Li(auth.), Lajos Hanzo(eds.)

New complex modeling equipment for simulating the electromagnetic houses of advanced third-dimensional digital systems

Based at the author's huge study, this publication units forth established and confirmed electromagnetic modeling and simulation equipment for studying sign and gear integrity in addition to electromagnetic interference in huge advanced digital interconnects, multilayered package deal buildings, built-in circuits, and published circuit forums. Readers will detect the country of the know-how in digital package deal integration and revealed circuit board simulation and modeling. as well as well known full-wave electromagnetic computational tools, the publication offers new, extra subtle modeling equipment, delivering readers the main complex instruments for reading and designing huge advanced digital structures.

Electrical Modeling and layout for 3D procedure Integration starts with a accomplished evaluation of present modeling and simulation equipment for sign integrity, strength integrity, and electromagnetic compatibility. subsequent, the booklet courses readers through:

  • The macromodeling strategy utilized in and electromagnetic modeling and simulation of advanced interconnects in third-dimensional built-in systems

  • The semi-analytical scattering matrix procedure in keeping with the N-body scattering conception for modeling of 3-dimensional digital package deal and multilayered published circuit forums with a number of vias

  • Two- and third-dimensional necessary equation equipment for the research of energy distribution networks in third-dimensional package deal integrations

  • The physics-based set of rules for extracting the identical circuit of a fancy energy distribution community in three-d built-in structures and published circuit boards

  • An identical circuit version of through-silicon vias

  • Metal-oxide-semiconductor capacitance results of through-silicon vias

Engineers, researchers, and scholars can flip to this e-book for the newest strategies and techniques for modeling and layout of digital packaging, three-d digital integration, built-in circuits, and revealed circuit boards.

Content:
Chapter 1 advent (pages 1–15):
Chapter 2 Macromodeling of complicated Interconnects in 3D Integration (pages 16–96):
Chapter three 2.5D Simulation strategy for 3D built-in platforms (pages 97–184):
Chapter four Hybrid critical Equation Modeling tools for 3D Integration (pages 185–240):
Chapter five Systematic Microwave community research for 3D built-in structures (pages 241–330):
Chapter 6 Modeling of Through?Silicon Vias (TSV) in 3D Integration (pages 331–360):

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Additional info for Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Example text

Zou, E. P. Li, and X. Cui, Extraction of equivalent network of arbitrarily shaped power-ground planes with narrow slots using a novel integral equation method, IEEE Trans. Microw. , vol. 58, no. 11, pp. 2850– 2855, 2010. References 13 [21] M. R. Abdul-Gaffoor, H. K. Smith, A. A. Kishk, and A. W. A. G. A. W. Glisson, Simple and efficient full-wave modeling of electromagnetic coupling in realistic RF multilayer PCB layouts, IEEE Trans. Microw. , vol. 50, no. 6, pp. 1445–1457, 2002. [22] C. Wang, J.

Cangellaris, E. X. Liu, Y. J. Zhang, M. D’Amore, J. Kim, and T. Sudo, Progress review of electromagnetic compatibility analysis technologies for packages, PCB and novel interconnects, IEEE Trans. Electromagn. , vol. 52, no. 2, pp. 248–265, 2010. [4] C. Paul, Analysis of Multiconductor Transmission Lines, 2nd. , Wiley, Hoboken, NJ, 2007. [5] P. A. Kok and D. D. Zutter, Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or 12 [6] [7] [8] [9] [10] [11] [12] [13] [14] [15] [16] [17] [18] [19] [20] CHAPTER 1 Introduction striplines, IEEE Trans.

Bower, and P. , Weinheim, 2008. net/. -P. Li, X. C. Wei, A. C. Cangellaris, E. X. Liu, Y. J. Zhang, M. D’Amore, J. Kim, and T. Sudo, Progress review of electromagnetic compatibility analysis technologies for packages, PCB and novel interconnects, IEEE Trans. Electromagn. , vol. 52, no. 2, pp. 248–265, 2010. [4] C. Paul, Analysis of Multiconductor Transmission Lines, 2nd. , Wiley, Hoboken, NJ, 2007. [5] P. A. Kok and D. D. Zutter, Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or 12 [6] [7] [8] [9] [10] [11] [12] [13] [14] [15] [16] [17] [18] [19] [20] CHAPTER 1 Introduction striplines, IEEE Trans.

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